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Journal

Total 210건 6 페이지

2010~before
10

"Stretchable and Foldable Silicon Integrated Circuits"

D.-H. Kim, J.-H. Ahn, W. M. Choi, H.-S. Kim, T.-H. Kim, J. Song, Y. Y. Huang, Z. Liu, C. Lu, J. A. Rogers,

Science
320, 507(Inner Cover Article) (Highlighted by Cover Article of EE Times)

LINK
9

"Complementary Logic Gates and Ring Oscillators on Plastic Substrates by Use of Printed Ribbons of Single-Crystalline Silicon"

D.-H. Kim, J.-H. Ahn, H.-S. Kim, K. J. Lee, T.-H. Kim, C.-J. Yu, R. G. Nuzzo, J.A. Rogers,

IEEE Electron Device Letters
29, 73 (Best Paper of the Year 2008, George Smith Award by Electron Device Society)

LINK
8

"Bendable Integrated Circuits on Plastic Substrates by Use of Printed Ribbons of Single-Crystalline Silicon"

J.-H. Ahn, H.-S. Kim, E. Menard, K. J. Lee, Z. Zhu, D.-H. Kim, R. G. Nuzzo, J. A. Rogers, I. Amlani, V. Kushner, S. G. Thomas, T. Duenas,

Applied Physics Letters
90, 213501(Cover Article)

LINK
7

"Reduction of Large Particles in Ceria Slurry by Aging and Selective Sedimentation and its Effect on Shallow Trench Isolation Chemical Mechanical Planarization"

D.-H. Kim, H.-G. Kang, S.-K. Kim, U. Paik, J.-G. Park,

Japanese Journal of Applied Physics
45, 6790

LINK
6

"Effect of Calcination Process on Synthesis of Ceria Particles, and its Influence on Shallow Trench Isolation Chemical Mechanical Planarization Performance"

D.-H. Kim, H.-G. Kang, S.-K. Kim, U. Paik, J.-G. Park,

Japanese Journal of Applied Physics
45, 4893

LINK
5

"Dependence of Non-Prestonian Behavior of Ceria Slurry with Anionic Surfactant on Abrasive Concentration and Size in Shallow Trench Isolation Chemical Mechanical Polishing"

H.-G. Kang, D.-H. Kim, T. Katoh, S.-J. Kim, U. Paik, J.-G. Park,

Japanese Journal of Applied Physics
45, 3896

LINK
4

"The Effect of Cerium Precursor Agglomeration on the Synthesis of Ceria Particles and Its Influence on Shallow Trench Isolation Chemical Mechanical Polishing Performance"

D.-H. Kim, S.-K. Kim, H.-G. Kang, J.-G. Park, U. Paik,

Japanese Journal of Applied Physics
44, 8422

LINK
3

"Agglomerated Large Particles under Various Slurry Preparation Conditions and Their Influence on Shallow Trench Isolation Chemical Mechanical Polishing"

D.-H. Kim, H.-G. Kang, S.-K. Kim, U. Paik J.-G. Park,

Japanese Journal of Applied Physics
44, 7770

LINK
2

"Effect of Dispersant Addition During Ceria Abrasive Milling Process on Light Point Defect (LPD) Formation after Shallow Trench Isolation Chemical Mechanical Polishing (STI-CMP)"

H.-G. Kang, T. Katoh, D.-H. Kim, U. Paik J.-G. Park,

Japanese Journal of Applied Physics
44, 238

LINK
1

"Modeling and Analysis of a Gas Sweeping Process for Polycarbonate Polymerization"

D.-H. Kim, K.-S. Ha, H.-K. Rhee, K. H. Song,

Journal of Applied Polymer Science
88, 1010

LINK

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