Welcome to the Translational Soft Electronics group!
"Complementary Metal Oxide Silicon Integrated Circuits Incorporating Monolithically Integrated Stretchable Wavy Interconnects"
D.-H. Kim, W.M. Choi, J.H. Ahn, H.S. Kim, J. Song, Y.Y. Huang, Z. Liu, C. Lu, C.G. Koh J.A. Rogers,
Applied Physics Letters
"Local Versus Global Buckling of Thin Films on Elastomeric Substrates"
S. Wang, J. Song, D.-H. Kim, Y. Huang and J. A. Rogers,
"Semiconductor Wires and Ribbons for High- Performance Flexible Electronics"
A. J. Baca, J.-H. Ahn, Y. Sun, M. A. Meitl, E. Menard, H.-S. Kim, W. M. Choi, D.-H. Kim, Y. Y. Huang, J.A. Rogers,
Angewandte Chemie International Edition
"Printable, Flexible, and Stretchable Forms of Ultrananocrystalline Diamond with Applications in Thermal Management"
T.-H. Kim, W. M. Choi, D.-H. Kim, M. A. Meitl, E. Menard, H. Jiang, J. A. Carlisle, J. A. Rogers,
Advanced Materials
"Stretchable and Foldable Silicon Integrated Circuits"
D.-H. Kim, J.-H. Ahn, W. M. Choi, H.-S. Kim, T.-H. Kim, J. Song, Y. Y. Huang, Z. Liu, C. Lu, J. A. Rogers,
Science
"Complementary Logic Gates and Ring Oscillators on Plastic Substrates by Use of Printed Ribbons of Single-Crystalline Silicon"
D.-H. Kim, J.-H. Ahn, H.-S. Kim, K. J. Lee, T.-H. Kim, C.-J. Yu, R. G. Nuzzo, J.A. Rogers,
IEEE Electron Device Letters
"Bendable Integrated Circuits on Plastic Substrates by Use of Printed Ribbons of Single-Crystalline Silicon"
J.-H. Ahn, H.-S. Kim, E. Menard, K. J. Lee, Z. Zhu, D.-H. Kim, R. G. Nuzzo, J. A. Rogers, I. Amlani, V. Kushner, S. G. Thomas, T. Duenas,
"Reduction of Large Particles in Ceria Slurry by Aging and Selective Sedimentation and its Effect on Shallow Trench Isolation Chemical Mechanical Planarization"
D.-H. Kim, H.-G. Kang, S.-K. Kim, U. Paik, J.-G. Park,
Japanese Journal of Applied Physics
"Effect of Calcination Process on Synthesis of Ceria Particles, and its Influence on Shallow Trench Isolation Chemical Mechanical Planarization Performance"
"Dependence of Non-Prestonian Behavior of Ceria Slurry with Anionic Surfactant on Abrasive Concentration and Size in Shallow Trench Isolation Chemical Mechanical Polishing"
H.-G. Kang, D.-H. Kim, T. Katoh, S.-J. Kim, U. Paik, J.-G. Park,
"The Effect of Cerium Precursor Agglomeration on the Synthesis of Ceria Particles and Its Influence on Shallow Trench Isolation Chemical Mechanical Polishing Performance"
D.-H. Kim, S.-K. Kim, H.-G. Kang, J.-G. Park, U. Paik,
"Agglomerated Large Particles under Various Slurry Preparation Conditions and Their Influence on Shallow Trench Isolation Chemical Mechanical Polishing"
D.-H. Kim, H.-G. Kang, S.-K. Kim, U. Paik J.-G. Park,
"Effect of Dispersant Addition During Ceria Abrasive Milling Process on Light Point Defect (LPD) Formation after Shallow Trench Isolation Chemical Mechanical Polishing (STI-CMP)"
H.-G. Kang, T. Katoh, D.-H. Kim, U. Paik J.-G. Park,
"Modeling and Analysis of a Gas Sweeping Process for Polycarbonate Polymerization"
D.-H. Kim, K.-S. Ha, H.-K. Rhee, K. H. Song,
Journal of Applied Polymer Science
