3
  • Slurry for CMP and Method of Polishing Substrates Using the Same
  • D.-H. Kim, S.M. Hong, J.H. Jeon, H.S. Kim, H.S. Park, U. Paik, J.G. Park and Y.K. Kim
  • Korea Patent (10-0599330)
  • 2006.07.04
2
  • Slurry for Polishing and Method Of Manufacturing the Same
  • D.-H. Kim, S.M. Hong, J.H. Jeon, Y.K. Kim, J.G. Park and U. Paik
  • Korea Patent (10-0584007)
  • 2006.05.22
1
  • Slurry for Polishing
  • D.-H. Kim, S.M. Hong, Y.K. Kim, J.G. Park and U. Paik
  • Korea Patent Application (10-2004-0107276)
  • 2004.12.16
XE Login