23
  • Conformable Actively Multiplexed High-Density Surface Electrode Array for Brain Interfacing
  • J.A. Rogers and D.-H. Kim
  • U.S. Provisional Patent Application pending under application serial number US 61/492983, filed 2011.06.03
22
  • Flexible and Stretchable Electronic Systems for Epidermal Electronics
  • J.A. Rogers and D.-H. Kim
  • U.S. Patent Application pending under application serial number US 13/492636, filed 2012.06.08 and U.S. Provisional Patent pending under application serial number US 61/495623, filed 2011.06.10
21
  • Waterproof Stretchable Optoelectronics
  • J.A. Rogers, R.-H. Kim, D.-H. Kim, D.L. Kaplan and F.G. Omenetto
  • U.S. Patent Application (US 2012/0165759 A1)
  • 2012.06.28 (converted to same patent name, currently patent pending under serial number 13/046/191)
20
  • Implantable Biomedical Devices on Bioresorbable Substrates
  • J.A. Rogers, D.-H. Kim, F. Omenetto, D. Kaplan, B. Litt, J. Viventi and Y. Huang
  • U.S. Patent Application (US 2011/0230747 A1)
  • 2011.09.22 (converted to US Patent Application “Implantable Biomedical Devices on Bioresorbable Substrates” currently patent pending under serial number 12/892,001)
19
  • High-Speed, High-Resolution Electrophysiology In-Vivo Using Conformal Electronics
  • J.A. Rogers, D.-H. Kim, J.D. Moss, D.J. Callans, B. Litt and J. Viventi
  • U.S. Patent Application (US 2012/0157804 A1)
  • 2012.06.21 (converted to same patent name, currently patent pending under serial number 12/968,637)
18
  • Printable, Flexible and Stretchable Diamond for Thermal Management
  • J.A. Rogers, T.H. Kim, W.M. Choi, D.-H. Kim, M.A. Meitl, E. Menard and J.A. Carlisle
  • U.S. Patent Application (US 2010/0052112 A1)
  • 2010.03.04 (converted to same patent name, currently patent pending under serial number 12/418,071)
17
  • Stretchable and Foldable Electronic Devices
  • J.A. Rogers, Y. Huang, H.C. Ko, M. Stoykovich, W.M. Choi, J. Song, J.H. Ahn and D.-H. Kim
  • U.S. Patent Application (US 2010/0002402 A1)
  • 2010.01.07 (converted to same patent name, currently patent pending under serial number 12/398,811)
16
  • Polishing grain and polishing slurry using the same and method of manufacturing the same
  • D.H. Kim, D.-H. Kim, S.M. Hong, M.W. Seo, Y.K. Kim, J.H. Hwang, U. Paik and J.G. Park
  • Korea Patent (10-0803729)
  • 2008.02.05
15
  • Slurry for CMP and Method of Polishing Substrates Using the Same
  • D.-H. Kim, S.M. Hong, J.H. Jeon, H.S. Kim, H.S. Park, U. Paik, J.G. Park and Y.K. Kim
  • Taiwan Patent (I283008)
  • 2007.06.21
14
  • Polishing Slurry, Method of Producing Same, and Method of Polishing Substrate
  • D.-H. Kim, S.M. Hong, J.H. Jeon, Y.K. Kim, J.G. Park and U. Paik
  • Taiwan Patent (I273632)
  • 2007.02.10
13
  • Slurry for Polishing and Method of Manufacturing the Same and Method of Polishing Substrates
  • D.-H. Kim, S.M. Hong, J.H. Jeon, Y.K. Kim, J.G. Park, U. Paik
  • Korea Patent (10-0663905)
  • 2006.12.26
12
  • Ceria Slurry for Chemical Mechanical Polishing and its Fabrication Method
  • D.-H. Kim, S.M. Hong, J.H. Jeon, Y.K. Kim, J.G. Park and U. Paik
  • Korea Patent (10-0665300)
  • 2006.12.26
11
  • Slurry for CMP and Method of Fabricating the Same and Method of Polishing Substrate
  • U. Paik, J.G. Park, S.K. Kim, Y.H. Kim, M.W. Seo and D.-H. Kim
  • Korea Patent (10-0641348)
  • 2006.10.2
10
  • Slurry for Polishing and Methods of Manufacturing the Same and Method of Polishing Substrates
  • D.-H. Kim, S.M. Hong, J.H. Jeon, Y.K. Kim, J.G. Park and U. Paik
  • Korea Patent (10-0638317)
  • 2006.10.18
9
  • Abrasive Particles, Slurry for Polishing and Method of Manufacturing the Same
  • D.-H. Kim, S.M. Hong, Y.K. Kim, D.H. Kim, M.W. Seo, J.G. Park and U. Paik
  • Korea Patent (10-0637403)
  • 2006.10.16
8
  • Ceria Slurry for Chemical Mechanical Polishing and its Fabrication Method
  • D.-H. Kim, S.M. Hong, J.H. Jeon, Y.K. Kim, J.G. Park and U. Paik
  • Korea Patent (10-0637400)
  • 2006.10.16
7
  • Slurry for Polishing and Method of Manufacturing the Same and Method of Polishing Substrates
  • D.-H. Kim, S.M. Hong, J.H. Jeon, Y.K. Kim, J.G. Park and U. Paik
  • Korea Patent (10-0613836)
  • 2006.08.17
6
  • Slurry for CMP and Methods of Fabricating the Same
  • D.-H. Kim, S.M. Hong, J.H. Jeon, H.S. Kim, H.S. Park, U. Paik and J.G. Park
  • Korea Patent, (10-0599327)
  • 2006.07.04
5
  • Slurry for CMP and Methods of Fabricating the Same
  • D.-H. Kim, S.M. Hong, J.H. Jeon, H.S. Kim, H.S. Park, U. Paik, J.G. Park and Y.K. Kim
  • Korea Patent (10-0599328)
  • 2006.07.04
4
  • Slurry for CMP and Methods of Fabricating the Same
  • D.-H. Kim, S.M. Hong, J.H. Jeon, H.S. Kim, H.S. Park, U. Paik, J.G. Park and Y.K. Kim
  • Korea Patent (10-0599329)
  • 2006.07.04
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