2024 Recent Advances in Conductive Hydrogels for Soft Biointegrated Electronics: Materials, Properties, and Device Applications 본문 Author Y. Shin, H. S. Lee, H. Jeong Co-author D.-H. Kim Journal Wearable Electronics Vol 1 Page 255 Year 2024 Link https://www.sciencedirect.com/science/article/pii/S2950235724000222?vi… 354회 연결 목록 이전글Soft Cardiac Patch Using a Bifacial Architecture of Adhesive/Low-Impedance Hydrogel Nanocomposites and Highly Conductive Elastomer Nanocomposites 24.12.14 다음글Soft Implantable Bioelectronics for the Management of Neurological Disorders and Cardiovascular Diseases 24.10.29