2021 Soft Implantable Bioelectronics 본문 Author J. H. Koo, J.-K. Song, D.-H. Kim, D. Son Journal ACS Materials Letters Vol 3 Page 1528 Year 2021 Link https://pubs.acs.org/doi/full/10.1021/acsmaterialslett.1c00438 188회 연결 목록 이전글Wafer-Scale Production of Transition Metal Dichalcogenides and Alloy Monolayers by Nanocrystal Conversion for Large-Scale Ultrathin Flexible Electronics 24.06.14 다음글Three-dimensional foldable quantum dot light-emitting diodes 24.06.14